| 摘要 |
PURPOSE:To efficiently polish a chip by separating many sheets of chips sheet by sheet by a supplying machine, taking out the chip in a straightening condition to many chip holding parts provided in the circumferential direction of a transcribing jig, under this condition, pressing a disk to a surface of the transcribing jig, transcribing these chips to the disk and holding the chip to be adhesively attached to the disk. CONSTITUTION:Separating chips 50 sheet by sheet on an index table 12 of a supplying machine, the chip 50 is taken out in a straightening condition onto many shallow chip holding parts 17 in the circumferential direction in a transcribing jig 16 by a head 15 of a robot-type take out machine 14. Next pressing a disk, forming an adhesive layer in the surface, to a surface of the transcribing jig 16, the chip 50, straightened on this jig 16, is transcribed (move) being left as placed in the straightened condition on a surface of the disk 18 applying an adhesive agent. Thus setting the disk, transcribing the chip 50, to a pressurizing machine, the chip 50 is adhesively attached firmly to the disk by applying heat and pressing force. Thereafter mounting the disk to a polishing machine, the chip 50 efficiently performs polishing and lapping in good yield rate. |
