| 摘要 |
For simultaneously populating printed circuit boards with electronic components by means of suitable automatic machines, temporary adhesive mounting of these components is necessary, before the soldering process ensures connection and mounting. Methods for fitting or transferring very small adhesive droplets are already known, for which purpose complicated and expensive devices are required. The invention is based on the object of simplifying and reducing the price of temporarily fitting electronic components on the printed circuit boards before the soldering process. This is achieved in that the electronic components and/or the printed circuit boards are provided after completion of their manufacture with a layer of inactive adhesive material, which is activated in order to bond the electronic components to the printed circuit boards, and is cured after the components have been fitted, for example by the influence of heat. The inactive adhesive material can be applied onto the printed circuit boards using, for example, the mask-printing method. Expensive and complicated machines for transferring metered adhesive droplets are thus no longer necessary.
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