| 摘要 |
PURPOSE:To enable a wafer to be easily mirror polished at the chamfered part by adapting a polishing drum to the chamfered part while rotating the wafer about an axial line by a chuck table. CONSTITUTION:When a wafer 1 is supplied onto a chuck table 17 of the first chamfering mechanism 6 from a loader part 3 by a conveying arm 84, holding the wafer 1 to be sucked onto the table 17 by a chuck means, the table 17 starts rotating around a tilt axial line, and also a polishing drum 32 simultaneously starts rotating. Subsequently, advancing a slide table 25 by a cylinder 24, the drum 32 is adapted to a chamfering part 1a of the wafer 1, performing mirror polishing. Here advancing the table 25, immediately before it reaches the final end part, the drum 32 is adapted to the wafer 1, and because a mounting member 27, while drawing up a weight 38, relatively retracts to the table 25 by an air slide mechanism 26, the drum 32 is pressed to the chamfering part 1a by acting force corresponding to the gravitational force of the weight 38 acting on the member 27. |
