| 摘要 |
PURPOSE:To prevent a package from cracking and to improve the hermetical sealability and moisture resistance of the package by forming a plurality of grooves extending toward a tab hanging lead on the rear face of a tab for placing a semiconductor chip. CONSTITUTION:A tab 3 is supported by a pair of tab hanging leads 2 to the outer frame 1 of a lead frame. A plurality of lead terminals 5 are supported through a tie bar 4 to the frame 1. Several grooves 7 extending toward the leads 2 are formed on the rear face of the tab 1. The grooves 7 of the rear face of the tab 1 can be easily formed by etching or pressing. Accordingly, in case of resin molding, voids are led along the grooves 7 to the lead 2, and a crack is effectively prevented. As a result, the hermetical sealability and moisture resistance of a package 23 are improved. |
