| 摘要 |
<p>PURPOSE:To automatically transfer a wafer even if the opening degrees of wafer pawls is not adjusted by providing a step formed on the inner face of a supporting base provided oppositely at both sides of a placing unit, a sensor for discriminating the size of a carrier, and an automatic wafer transfer machine connected to the sensor. CONSTITUTION:A positioning device 1 for a carrier 2 has a step 6 formed on the inner face of a supporting base 5 provided oppositely at both sides of a placing unit 4 provided on a carrier base 3, a lower stage 8, and an upper stage 10. The photodetectors 13b, 14b of sensor 13, 14 are connected through a computer 17 to an automatic wafer transfer device 18. When the carrier 2 is placed on the placing unit 4 of the base 3, its legs are set on any of the stages 10, 8, and positioned. The sensors 13, 14 for discriminating the size of the carrier designate the opening degrees of wafer pawls 24, 25 of the transfer device 18 and automatically transfer the wafer.</p> |
