| 发明名称 |
IC PACKAGE SUBSTRATE |
| 摘要 |
|
| 申请公布号 |
JPS6467947(A) |
申请公布日期 |
1989.03.14 |
| 申请号 |
JP19870226001 |
申请日期 |
1987.09.08 |
| 申请人 |
NEC CORP |
发明人 |
IWATA TADASHI |
| 分类号 |
H05K1/11;H01L23/12 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
您可能感兴趣的专利
Method for manufacturing semiconductor device with a recessed channel
Method of manufacturing semiconductor device
Using plasma proteomic pattern for diagnosis, classification, prediction of response to therapy and clinical behavior, stratification of therapy, and monitoring disease in hematologic malignancies
Solid nutrient media useful for isolating and identifying alkaliphilic bacteria
Laccases, nucleic acids encoding them and methods for making and using them
Color toner for flash fusing, method for producing the same, and electrostatic image developer, process cartridge, and image forming apparatus using the same
Selective polishing of fuser members
Biodegradable film having honeycomb structure
Bioactive material delivery systems comprising sol-gel compositions
Solvent systems for pour-on formulations for combating parasites
Use of transmission dyes for protecting human skin from browning and ageing
Method for producing chlorine
Calibration system, material delivery system, and methods for such delivery and calibration
Process for producing stretched film, stretched film, polarizer, and liquid-crystal display
Reversible electrochemical sensors for polyions
Glass laminate containing poly vinyl acetal
Tape installation device and method for the construction of a laminate
Method of cleaning and after treatment of optical surfaces in an irradiation unit
Operating method for a large dimension plasma enhanced atomic layer deposition cavity and an apparatus thereof
Elliptical seal interface for filter assembly
