发明名称 |
Semiconductor element sealing structure |
摘要 |
A semiconductor element mounted on a substrate is sealed with a silicone gel which has a complex modulus of elasticity such that breakage of solder bumps due to thermal fatique occurs preferentially by shear stress thereto due to a difference between thermal expansion coefficients of the semiconductor element and the substrate, not by tension thereto due to thermal expansion of the silicone gel between the semiconductor element and the substrate.
|
申请公布号 |
US4812897(A) |
申请公布日期 |
1989.03.14 |
申请号 |
US19870093159 |
申请日期 |
1987.09.01 |
申请人 |
NIPPONDENSO CO., LTD. |
发明人 |
NARITA, RYOICHI;SONOBE, TOSHIO;ITO, HITOSHI;ISHIKAWA, JUNJI;TAKENAKA, OSAMU;SUGIURA, JUNJI |
分类号 |
H01L23/29;C08L83/07;H01L21/56;H01L21/60;H01L23/24;H01L23/31;(IPC1-7):H01L23/28;H01L23/02;B32B27/38;B32B9/04;C08F8/00;C08F283/00;C08G8/28 |
主分类号 |
H01L23/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|