| 摘要 |
<p>In a circuit board, a wiring pattern (2) is formed on an insulating plastic film (1), and connecting terminals (2a, 2b, 2c, 2d) are formed at end portions of the wiring pattern (2). Connecting material layers (3a, 3b, 3c, 3d) are uniformly formed on the connecting terminals to connect the circuit board to electronic components (6, 7, 8, 9). The connecting material layers are kept in a dry state at room temperature, have a substantially insulating property in every direction, and have conductivity along the direction of thickness thereof when they have been heated, compressed and melted. Connecting terminals (6a, 7a, 8a, 9a) of the electronic components are positioned on the connecting material layers and the layers are then partially bonded by thermocompression, so that the electronic components are electrically connected to the circuit board. The connecting material is a thermoplastic adhesive (4) containing conductive particles (5). <IMAGE></p> |
