| 摘要 |
PURPOSE:To execute a bonding operation with less contact resistance by a method wherein a compound conductor is installed between an oxide-based superconductor and a metal electrode for electricity conduction use and the compound semiconductor and the oxide-based superconductor are sintered. CONSTITUTION:When an oxide-based superconducting material represented by a Y-Ba2-Cu3-O7-delta-based material having a perovskite structure and a compound conductor, e.g. a (La1-xSrx)2CuO4 compound, are sintered, bonding strength is enhanced because their crystal structures are close to each other. In this case, La0.5Sr0.5CuO3 or the like can be used as a material whose crystal structure is close to the oxide-based superconductor 1. In addition, by using this compound conductor 2, mechanical bonding of a solder 4 or the like or bonding to a metal evaporated layer becomes strong. Because contact resistance between this compound conductor 2 and a metal electrode 5 is small, the contact resistance as a whole is reduced. It is preferable that a ceramic as the compound conductor used in this case has a resistivity of at least less than 10<-2>OMEGA.cm. In addition, it is desirable that the oxide-based superconductor and the compound conductor are sintered at 850-1000 deg.C. |
