发明名称 CONDUCTOR PATTERN FORMING METHOD
摘要 PURPOSE:To form a conductor pattern so as to linearly link to a controlling machine, by moving a jetting head relatively to a circuit board, inputting a required electric signal corresponding with the conductor pattern to the jetting head, jetting a jet liquid from the jetting head, and making conductor pattern material attach to a circuit board. CONSTITUTION:A controlling part 8 reads out the data of a conductor pattern from a storage part 9, and shows the pattern on a display 10. Then the controlling part 8 moves, via a head transferring mechanism 7, a jetting head 5 from a left starting point to a right direction A along the surface of a circuit board 1, and supply electric signal corresponding with the form of the conductor pattern to the jetting head 5. At this time, a holder 2 and the circuit board 1 set at the lowest position, and the jetting head 5 faces the highest position of the circuit board 1. While moving in the right direction A along the highest position of the substrate 1 surface, the jetting head 6 jets a jet liquid 4 containing conductor pattern material. The jetted jet liquid 4 attaches on the surface of the circuit board 1, and forms in the right and left direction a figure corresponding with a part of the conductor pattern, at the highest position of the circuit board 1 surface.
申请公布号 JPS6464290(A) 申请公布日期 1989.03.10
申请号 JP19870221672 申请日期 1987.09.03
申请人 MURATA MFG CO LTD 发明人 SHIMABARA YUTAKA
分类号 H05K3/10;B41J2/015;H05K3/12 主分类号 H05K3/10
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