| 摘要 |
<p>PURPOSE:To increase discharge resistance for decreasing stress applied to a semiconductor element by static discharge and to prevent breakdown of the semiconductor element, by forming a high resistance coat film at least on the tip ends of lead terminals. CONSTITUTION:A lead terminal 2 consists of a lead material 2 basically composed of Fe-Ni alloy or Cu alloy, an Ni plated film 4 covering the surface of the lead material 3, a solder film 5 formed on the Ni plated film 4 and a high resistance film 6 of a carbon paste material deposited to cover the solder film 5 at the tip end of the lead terminal 2. Since the surface of the tip end of the lead terminal 2 is covered with the high resistance film 5, a discharge passage of static charge charged within the lead terminal 2 is defined following the course from the high resistance film to a spark discharge space and to the grounding system. Accordingly, higher discharge resistance can be obtained than by prior arts.</p> |
