| 摘要 |
PURPOSE: To reduce the change of damage done to IC chip even when bending stress is exerted on IC card by dividing base film into terminal and IC portions and providing a narrow and long slot at the boundary of the both on the base film. CONSTITUTION: TAB substrate 1 corresponding to substrate of base film 2 is divided into terminal portion 21 forming external terminals 7, 7... and IC portion 23 that mounted IC chip 8, and the both portions 21 and 23 have been kept separated with slot 22. The slots 22 are punched in slim hole of about 10 mm long and about 1 mm wide, and wiring pattern 6, 6... are biased and disposed near circumference on TAB substrate 1 so as to form the slot 22 as long as possible. Thus formed improved TAB substrate 20 is incorporated into IC card main body to form an IC card. Accordingly, bending stress of the base film 2 is released by the slot 22, the IC chip 8 does not receive displacement or deformation that may bring damage, and commodious IC card can be obtained. |
