| 摘要 |
<p>PURPOSE:To reduce the number of manufacturing steps of an optical writing head, by mounting a light-emitting means on a substrate by a flip chip system so that the light-emitting part side of the light-emitting means is opposed to the surface of the substrate. CONSTITUTION:An LED chip 13 is mounted on a transparent substrate 11 by a flip chip system so that a light-emitting part 13a of the chip is opposed to the surface of the substrate. A fiber bundle 16 comprising a plurality of optical fibers and having one end part 16a opposed to the light-emitting part 13a is embedded in a substrate 11, and light emitted from the light-emitting part 13a of the LED chip 13 is transmitted through a transparent synthetic resin 15 to enter the fiber bundle 16 through the end part 16a. The light is transmitted through the fiber bundle 16 at high efficiency to strike the surface of an object 18 to be exposed, such as a photosensitive belt, making contact with the other end part 16b of the fiber bundle 16 which part 16b is shaped to form a curved surface. Since the other end part 16b is shaped to form the curved surface, it makes smooth contact with the object 18, and does not damage the object 18.</p> |
