| 摘要 |
<p>An apparatus and method for drilling holes in printed wiring boards formed of a plurality of materials wherein two or more laser beams are combined along a common path and preferably focussed on the desired drilling site. The wavelengths of the lasers are selected such that they are each rapidly absorbed and therefor vaporized at least one of said materials. The laser beams are preferably focussed by a beam combining mirror. The lasers can be controlled to provide simultaneous or sequential emission of the laser beams.</p> |
