| 摘要 |
A planar circuit arrangement is specified which carries on a substrate (11) a layered structure of conductor layers (12, 13) which are separated from one another by insulator layers (14), and which partially overlap. An electrical connection is produced between the mutually overlapping conductor layers (12, 13) by means of a cutout (15), preferably produced with the aid of a laser beam, and vaporising the lower conductor layer or fusing the insulator and conductor layer. <IMAGE>
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