发明名称 AUTOMATIC MONITOR FOR ELECTROLESS PLATING SPEED
摘要 PURPOSE:To monitor an electroless plating speed automatically on time, by automatically adjusting the peak voltage of a potential difference between a sample electrode and a reference electrode until the voltage reaches a value in the optimum preset range, and computing the electroless plating speed based on the relationship between the overvoltage and the time of this adjustment. CONSTITUTION:A potential difference between a sample electrode W and a reference electrode R is inputted into an input terminal (a) of an adding amplifier 6 through an operation amplifier 3. An output from an inverting amplifier 7 is inputted into an input terminal (b) of the adding amplifier 6. As a result, a curve showing relationship between the overvoltage and the time is obtained. A peak voltage based on said curve is inputted into an input terminal (b) of a high speed switch 10. A CPU 4 increases the amplitude of an amplifier 15 stepwise so that the peak voltage is located in the preset range of the optimum peak voltage. Thus the peak voltage is adjusted. The data of the curve of relation between the overvoltage and the time, which is obtained with the adding amplifier 6, are computed as a trial, and the electroless plating speed is computed.
申请公布号 JPS6463852(A) 申请公布日期 1989.03.09
申请号 JP19870220974 申请日期 1987.09.03
申请人 BROTHER IND LTD 发明人 MIYABAYASHI TAKESHI
分类号 C23C18/16;C23C18/31;C23C18/34;C23C18/40;G01N27/416 主分类号 C23C18/16
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