CAVITY PACKAGE FOR SAW DEVICES AND ASSOCIATED ELECTRONICS

摘要

A multilayer ceramic package (10) for surface acoustic wave (SAW) devices is disclosed which includes two separate cavities (27,32) disposed in a vertical arrangement. The SAW device is positioned in a first one of the cavities and the electronics associated with the operation of the SAW device are located in the second, remaining cavity. Extremely short lead lengths between the SAW device and the electronics, necessary for high frequency applications, are provided by using a number of metallized vias (48,50) formed through the multilayer structure. By positioning the SAW device and the electronics in two separate cavities, the manufacturing process associated with providing a single chip, fully integrated SAW arrangement is greatly simplified. The utilization of multilayer ceramic package offers the additional advantage of providing a hermetic structure.