| 摘要 |
PURPOSE:To prevent stripping of wiring from the base metal of a bump, by making the average crystal particle diameter of Al or Al alloy wiring less than specified dimensions. CONSTITUTION:This device makes crystal particle diameters of Al wiring 15 small and then an average crystal particle diameter becomes 2mum or less. In this way the area of the interface between grain boundary and the base metal film 8 of the first bump increases relatively by making the crystal particle diameters of Al wiring 15 small and then adhesion between Al wiring 15 and the base metal film 8 of the first bump grows intense. Thus this approach does away with stripping of Al wiring 15 from the base metal film 8 of the bump. |
