| 发明名称 |
SURFACE-MOUNTABLE PACKAGE FOR ENCAPSULATED TAP-AUTOMATEDSURFACE-MOUNTABLE PACKAGE FOR ENCAPSULATED TAP-AUTOMATED-BONDED INTEGRATED CIRCUIT MODULES -BONDED INTEGRATED CIRCUIT MODULES |
| 摘要 |
A surface-mountable package formed by nesting an encapsulated tape-automated-bonded integrated circuit module (l0) in between two synthetic plastics rings (30,32) snapped together. |
| 申请公布号 |
EP0235925(A3) |
申请公布日期 |
1989.03.08 |
| 申请号 |
EP19870300711 |
申请日期 |
1987.01.28 |
| 申请人 |
GENERAL MOTORS CORPORATION |
发明人 |
JUNG, JAMES EUGENE;KOORS, MARK ANTHONY;LUTZ, PHILLIP A. |
| 分类号 |
H01L23/32;H01L23/057;H01L23/495;H01L23/50;H05K3/34;(IPC1-7):H05K7/02;H01L23/48;H05K13/04 |
主分类号 |
H01L23/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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