| 摘要 |
PURPOSE:To obtain a multilayer print wiring board with low dielectric constant by combining a specified resin with a resin constituting an inner layer. CONSTITUTION:An inner layer 1, a prepreg 2 and an outer layer 3 are preliminarily provided. As the inner layer 1, the material in which the circuits becoming the circuits of the inner layer is formed on both surfaces of the laminate composed of the combined resin of tetrafluoroethylene resin and other fluorine resin, is used. Since the combined resin of tetrafluoroethylene resin and other fluorine resin is used in this multilayer printed wiring board, while the dielectric constant of the printed wiring board may be lowered, the thermal deformation of the inner layer is prevented in forming the multilayer, and its dimension change may be minimized. |
