| 摘要 |
PURPOSE:To eliminate a possibility of the generation of blow-holes and to make it possible to perform a smear removal in a short time by a method wherein, after a multilayer printed-wiring board, molded laminatedly in a state that the degree of cure of a resin is within a specified range, is subjected to a perforation process, a plasma treatment is performed to remove smears at the perforated part and thereafter, a through-hole plating is performed. CONSTITUTION:A perforating work is performed on a multilayer printedwiring board made in a state that the degree of cure of a resin is within a range of 40-90% with a drill and so on and moreover, a treatment of smear removal at the perforated part is performed. If the degree of cure is less than 40%, the bonding strength of the resin is too low and there is a possibility that the board can not withstand a process before a through hole work and a through hole work process. Therefore, the degree of cure of the resin is set in 40% or more. The treatment of smear removal at the perforated part is performed by a method of plasma treatment. The effect of the plasma treatment is great to smears being formed of a resin, which is not cured completely, and the plasma treatment method can be performed in a treating time shorter than the treating time to smears being formed of a completely cured resin. |
