发明名称 |
SEMICONDUCTOR COOLING APPARATUS AND COOLING METHOD THEREOF |
摘要 |
<p>High heat generation member (1) of electronic integrated circuit etc. is boiled and cooled. A refrigerant steam is generated by cooling of the heat generation member (1) and is condensed by a condenser (5) which is provided in an upper portion of a container (2). A refrigerant steam flow path (4) and a condensed refrigerant flow path (6) from the condenser (5) are separated with a partition wall (7). The condensed liquid (3) sent back to the partition wall (7) is supplied to the heat generation member (1) through the partition wall (7).</p> |
申请公布号 |
EP0298372(A3) |
申请公布日期 |
1989.03.08 |
申请号 |
EP19880110467 |
申请日期 |
1988.06.30 |
申请人 |
HITACHI, LTD. |
发明人 |
OHASHI, SHIGEO;KUWABARA, HEIKICHI;NAKAJIMA, TADAKATSU;NAKAYAMA, WATARU;SATO, MOTOHIRO;KASAI, KENICHI |
分类号 |
H01L23/427;(IPC1-7):H01L23/42;H05K7/20 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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