| 摘要 |
PURPOSE:To prevent the printing pit (plating pinhole) from being caused by providing printed wiring board with oscillation while it is being processed. CONSTITUTION:A printed wiring board is oscillated during the preprocess of through hole plating and the regular through hole plating process. Consequently, any bubbles adhering to the through hole and the surface of the printed wiring board can be removed enabling a plated layer without any plating pit to be formed in the through hole. Furthermore, even in the panel plating process performed after the through hole plating process as well as the pattern plating process, the bubbles adhered to the surface of printed wiring board are already removed preventing the plating pit from being caused even in fine patterns. In such a constitution, it is recommended that as oscillator is fixed to a plating jig or the jig is made of the oscillator so that the oscillator may be connected to outer circuit to provide the printed wiring board with oscillation of 10Hz-10 MHz. |
