发明名称 |
PROCESS FOR THE PREPARATION OF MODIFIED PHENOL RESIN BINDERS AND THEIR USE IN THE PRODUCTION OF CHIP-BOARD PANELS |
摘要 |
<p>1. Process for producing modified phenolic resin bonding agents characterized by preparing as known per se phenol-formaldehyde resins with a viscosity of higher than 300 mPa.s (at 20 degrees C) with a solids content of 20 to 55% and adding to the viscous phenolic resin solutions 2 to 30 wt.-% urea, relative to the phenolic resin solution, the phenol-formaldehyde resins being prepared with as much alkali as is required to ensure that the modified resin solution resulting therefrom contains 2 to 12 wt.-% alkali (titrated, calculated as NaOH).</p> |
申请公布号 |
EP0146881(B1) |
申请公布日期 |
1989.03.08 |
申请号 |
EP19840115270 |
申请日期 |
1984.12.12 |
申请人 |
DEUTSCHE TEXACO AKTIENGESELLSCHAFT |
发明人 |
BUSCHFELD, ADOLF;LATTEKAMP, MATTHIAS;RIPKENS, GERD;SCHITTEK, HANS |
分类号 |
C08G14/08;C08L61/10;C09J161/34 |
主分类号 |
C08G14/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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