发明名称 WIRE BONDER
摘要 PURPOSE:To suppress unwanted vibration of capillary and prevent defective junction by utilizing a rubber rod or rubber string as an energizing material which pressurizingly places the capillary toward a semiconductor pellet. CONSTITUTION:A capillary 1 which pressurizingly places the bonding wire to the semiconductor pellet P is provided at the end point of bonding lever 2, the intermediate part of bonding lever 2 is supported by the axis 3 and an energizing material 4A, which energizes upward the end point of lever and is composed of a material having the vibration attenuating coefficient which is equal or almost equal to that of rubber, is also provided. During operation, the one end of control lever 9 is pushed downward by the cam 12 and the end point of bonding lever 2 is pulled upward by the energizing material 4A. Thereby, the capillarly 1 moves downward. Vibration by high speed reciprocal operation is absorbed by the vibration attenuating effect of the energizing material 4A, and thereby unwanted vibration is not given to the capillary 1 and defective welding can be prevented.
申请公布号 JPS5936939(A) 申请公布日期 1984.02.29
申请号 JP19820146177 申请日期 1982.08.25
申请人 TOKYO SHIBAURA DENKI KK 发明人 YAJIMA KOUICHI
分类号 H01L21/60 主分类号 H01L21/60
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