| 摘要 |
PURPOSE:To improve effectiveness and reduce cost by using ceramics having the main component of aluminum nitride as an insulation body. CONSTITUTION:Semiconductors 1 and 2 of a n type and a p type are connected and fixed in electrically series and thermally parallel with pure Cu plates 3a and 3b. AlN plates 4 and 5, in which a Cu pattern having the same shape as plates 3a and 3b is formed by a metalization method, are joined via lower temperature solder. A thermoelement is formed with such a pair of the semiconductors 1 and 2, plates 3a and 3b, and plates 4 and 5 as an insulation body. Electric power can be obtained by giving a temperature difference to the thermoelement, on the other hand, a temperature difference is produced by flowing electric current. A compound of Bi and Te, a compound of Bi and Sb, and others are used as a thermoelectric substance. Ceramics, having the main component of AlN and the additive of Y2O3 of 0.5-5.0wt.%, are preferable as an insulation body, and are formed by hotpressing raw material. |
