Semiconductor die bonding with conductive adhesive

摘要

An improved semiconductor assembly includes a semiconductor die that is mounted on a carrier, such as a tape or a substrate, by means of an anisotropically electrically conductive adhesive. The adhesive forms an electrically conductive path between electrical conductors on the carrier and other conductors on the die so that the die can be probe tested before the adhesive is cured and before the die is permanently bonded to the carrier.