| 摘要 |
An improved alignment method usable in a step-and-repeat type alignment and exposure apparatus for photolighographically transferring images of a pattern of a reticle onto different shot areas on a semiconductor wafer, for manufacture of semiconductor devices. According to this method, the alignment is executed with respect to an X direction, a Y direction and a rotational direction parallel to a plane containing the X and Y directions. With regard to the rotational direction, positional deviation of the wafer as a whole with respect to the reticle is measured and corrected prior to the initiation of the step-and-repeat photoprinting. With regard to the X and Y directions, detection and correction of any deviation are executed for each of the shot areas of the wafer. By this, high-accuracy and high-speed alignment is attainable for all the shot areas of the wafer.
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