| 摘要 |
PURPOSE:To avoid the inclination of an LED chip and keep the photoelectric conversion surface horizontal and improve the accuracy of an optical system by a method wherein at least one facing bump electrode which is not directly connected to the photoelectric conversion part is provided so as to face a bump electrode with the photoelectric conversion part between. CONSTITUTION:When a diffusion mask 14 is selectively removed and an electrode wiring layer 17 for a facing electrode is connected electrically to an N<+> type epitaxial layer 12, a facing bump electrode 18 serves as a common electrode. Therefore, if a DC voltage is applied between the facing bump electrode 18 and a light emitting part bump electrode 16, a light is emitted from a P<+> type diffused layer 13 which is a light emitting part and a function as a light source for an LED printer and so forth is provided. If the electrode wiring layer 17 is insulated from the N<+> type epitaxial layer 12 by a diffusion mask 14, the facing bump electrode 18 serves as a dummy bump electrode. With this constitution, as the facing bump electrode 18 is provided so as to face the light emitting part bump electrode 16, the inclination of an LED chip can be easily avoided and its light emitting surface can be kept horizontal when the LED array chips are mounted. |
