| 摘要 |
<p>PURPOSE:To enhance packaging density and trim resistor accurately to reduce trimming man-hour by covering one part of lower layer resistor with an insulation layer and forming upper-layer resistor on the insulation layer while crossing over the lower layer resistor. CONSTITUTION:After a silicide printed resistor 1 which mainly consists of molybdenum silicide is printed on a ceramic substrate 5, is dried, and is calcined in nitride atmosphere, an inorganic glass insulation layer 2 is printed on the printed resistor 1 and is calcined in a dry nitride atmosphere. Then, it is electrically insulated by the insulation layer 2 and silicide printed resistor 3 which crosses over with the printed resistor 1 is printed, is calcined and formed in a nitride atmosphere after drying. In this manner, the overlapped printed resistors 1 and 3 which are insulated electrically by the insulation layer 2 are formed. The trimming of resistor 6 is performed together later.</p> |
