发明名称 PASTE COATING PROCESS
摘要 PURPOSE:To coat the surface to be coated with specified amount of paste evenly and in high density while cutting down the installation cost by a method wherein a pot 14 with its bottom surface formed of multiple pores is filled with paste while multiple bars are inserted into the pores from the upper part of the pot to coat the surface to be coated with the paste bonded to the ends of the bars. CONSTITUTION:A punch holder 18 is lowered to insert punches 15 into pores 13. Thus, silver paste 2 is bonded to the ends of punches 15. Then, the punch holder 18 is further lowered to make the silver paste 2 bonded to the ends of punch 15 abut against the bottom surface 11 of a package 3 and then the punch holder 18 is raised. Through these procedures, the bottom surface 11 of the package 3 is coated with the silver paste 2 in a dotted line. Therefore, the bottom surface can be coated with the silver paste 2 in high density by narrowing the gaps between the pores 13.
申请公布号 JPS6459922(A) 申请公布日期 1989.03.07
申请号 JP19870217583 申请日期 1987.08.31
申请人 SONY CORP 发明人 IKEDA SHIGEO
分类号 H01L21/52;B23K3/06;H05K3/34 主分类号 H01L21/52
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