| 发明名称 |
Process for bonding die to substrate using a gold/silicon seed |
| 摘要 |
An improved method for eutectically bonding a silicon wafer onto a gold preform is described. A gold/silicon seed is placed on a pure gold preform. Then a die is placed onto the pure gold preform and the gold/silicon seed, wherein the seed acts as a catalyst to form an eutectic bond. |
| 申请公布号 |
US4810671(A) |
申请公布日期 |
1989.03.07 |
| 申请号 |
US19880170079 |
申请日期 |
1988.03.14 |
| 申请人 |
INTEL CORPORATION |
发明人 |
BHATTACHARYYA, BIDYUT K.;TOSAYA, ERIC S. |
| 分类号 |
B23K35/00;B23K35/30;H01L21/58;(IPC1-7):H01L23/36;H01L21/304;B01J17/00 |
主分类号 |
B23K35/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
