| 摘要 |
<p>PURPOSE:To provide the titled compsn. having excellent adhesion, heat resistance during soldering, electrical characteristics, etc., by blending a specific epoxy resin with a carboxyl-contg. acrylonitrile copolymer, a curing promotor and a curing agent at specified wt. ratio. CONSTITUTION:100pts.wt. at least one epoxy resin (A) having an epoxy equivalent of 250-1,200g/eq and selected from bisphenol A epoxy resins, o-cresolic novolak epoxy resins, polyphenolic epoxy resins and products of a reaction of an epoxy resin with a butadiene-acrylonitrile copolymer having carboxyl groups at both terminals is mixed with 50-300pts.wt. carboxyl-contg. acrylonitrile copolymer (B) (e.g., Nipol which is a trade name of a product of Nippon Zeon Co., Ltd.), 0.5-5pts.wt. tertiary amine or imidazole compd. (C) (e.g., 2- ethyl-4-methylimidazole), and a curing agent for the epoxy resin.</p> |
