| 摘要 |
<p>This invention relates to a new and improved hermetically sealed container for semiconductor and other electronic devices, to a novel sealing cover for use in fabricating the above-referenced hermetically sealed container, and to novel processes for manufacturing said container and cover. The specification discloses an improved method of fabricating a hermetically sealed container consisting of a body having a cavity therein for receiving a semiconductor device and a cobalt-nickel-iron alloy sealing cover therefor comprising superimposing upon the sealing cover and in registry with the periphery thereof a preformed ring of heat-fusible material of a thickness which is a minor fraction of that of said cover; engaging said ring with at least one pair of spaced electrodes; passing a pulse of current through the electrodes, the ring, and the cover, thereby producing an effective attachment between said ring and said cover adjacent each of said electrodes; disposing a semiconductor device in said cavity; assembling the cover on the body with the ring in contact with the body surrounding the cavity; and heating the assembly to a temperature sufficient to fuse the ring to the cover and to the body, the improvement comprising a sealing cover plated with a nickel/indium alloy containing at least about 0.1 weight percent indium by weight of the alloy.</p> |
