发明名称 Frame assembly for mounting wiring devices to panel
摘要 A frame assembly for mounting an electric wiring device to a building panel comprises an exposing frame having a front plate to be disposed on a front face of the panel, and rearwardly extending side plates projecting through an aperture in the panel. The side plates carry projections arranged to underlie an edge of the aperture to retain the exposing frame to the panel. A supporting frame is provided for holding at least one of a plurality of modularized wiring devices. The supporting frame is disposed to the rear of the panel when the supporting frame is coupled to the exposing frame. The supporting frame includes tongues arranged to be positioned to the inside of the projections of the exposing frame to elastically support the projections from being uncoupled from the panel. The modular-dimensioned wiring devices are thereby allowed to be mounted to the panel easily without screws or the like.
申请公布号 US4810842(A) 申请公布日期 1989.03.07
申请号 US19870092526 申请日期 1987.09.03
申请人 MATSUSHITA ELECTRIC WORKS, LTD. 发明人 KANAYA, MASAYUKI;MASUDA, TOSHIYUKI;YAMADA, OSAMU
分类号 H05K7/12;H02B1/048;(IPC1-7):H01H9/00 主分类号 H05K7/12
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