| 摘要 |
PURPOSE:To secure solder layer positively at bent part and solve improper conduction at bent part of metal core circuit board by closely forming plural conduction patterns at the bent part of metal core circuit board crossing the bending direction at right angle. CONSTITUTION:Conductive layers 14a and 14b constituting one part of circuit are formed through an insulation layer 13 on a step surface surrounding a bent part 12 of a substrate 11. Also, plural conduction patterns 15... are formed closely each other at the bent part 12 of the above substrate 11 so that they cross the bending direction A of the substrate 11 at right angle. Also, a soldering layer 16 is formed on the bent part 12 of the substrate 11 so that it covers the conduction pattern 15 and the edges of the conduction layers 14a and 14b. Since plural conduction patterns 15 are formed in parallel with the direction which crosses the bending direction A of the substrate 11 at right angle, cracks due to stress when a substrate is bent are not generated continuously and the soldering layer 16 can be securely formed on the conduction pattern 15. |
