| 摘要 |
PURPOSE:To enable high-density wiring and to obtain multi-wire wiring plate which is superb in insulation under high temperature by using a compound where a specified amount of a particular epoxy resin, alkylated melanin resin, and fluororesin are blended as an adhesive in multi-wire wiring plate. CONSTITUTION:A composition material of adhesive coating consists of the followings; (1) Epoxy resin with a molar weight of 5000 or more, (2) Epoxy resin of 100pts.wt. where the ratio of epoxy resin with a mol.wt. of 5000 or less is 10:90-90:10, (3) Alkylated melanin resin 2-80pts.wt., (4) Fluororesin of 5-250pts.wt. which can be dissolved by organic solvent, and (5) Crosslinking agent of 0.1-50pts.wt. Addition of soluble fluororesin to organic solvent improves flexibility and wiring performance and also reduces dielectric constant. As a crosslinking agent, a mixture with acidic organic chemical compound with imidazole derivative, carboxyl group, sulfone group, and one having at least one hydroxyl group is used. It controls the response between epoxy resin and alkylated melanin resin and improves wiring performance in semi-cured state. |
