发明名称 PRODUCTION OF PUNCHING DIE BY LASER
摘要 PURPOSE:To uniformize a cut width and to improve accuracy an working efficiency by cutting a die material by converging a laser light after shaping it in a circular section in case of manufacturing a punching die by laminating plural die materials subjected to laser beam cutting. CONSTITUTION:The upmost layer die materials 12a, 12b of a punch 10 and die 11 are subjected to laser cutting by thinning them more than the lower layer die materials 13a..., 13b.... The die materials 12a, 13a... of the punch 10 and die materials 12b, 13b... of the die 11 are welded each other after laminating them respectively and fitted to holders 14, 15 to make a punching die. On the other hand, in these cuttings a laser light L is injected from a optical fiber 2 in a radiation circle by transferring it by the optical fiber 2, a spot becomes of a circle by a condensing lens 4 and an uniform cut width is obtainable even if the scanning direction differs. In case of no propagation by the optical fiber a circular spot may be made by passing the laser light through an opening plate.
申请公布号 JPS6457993(A) 申请公布日期 1989.03.06
申请号 JP19880174912 申请日期 1988.07.15
申请人 TOSHIBA CORP 发明人 ISHIKAWA KEN
分类号 B23K26/00;B23K26/06;B23K26/073;B23K26/38 主分类号 B23K26/00
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