| 摘要 |
<p>PURPOSE:To manufacture an active matrix substrate with a flat surface where there is no trouble even when thin film transistors, scanning wiring, and signal wiring are mounted by polishing away an unnecessary insulator sticking on the surface of the substrate when an insulating filler is charged in a pinhole part on the surface of the substrate. CONSTITUTION:A pinhole flawed part 16 is filled with the liquid filler and heat-treated in an acid or inert atmosphere to obtain an insulator 17. The filler is prepared by dissolving organic metal, etc., into a solvent, a glass substrate 18 is dipped, and deaeration is carried out with an ultrasonic wave or by vacuum suction, etc., to fill the pinhole flawed part 16. The insulator 17 formed swelling on the surface of the substrate 18 is polished away finally to charge the insulator 17 only in the flawed part selectively. Consequently, the transparent insulating substrate having no pinhole in the surface is obtained and the thin film active matrix substrate is manufactured which has no characteristic deterioration even when electrode wiring for thin film transistors, scanning, signals, etc., is provided.</p> |
