| 摘要 |
PURPOSE:To conduct bonding not peeled after joining by installing a film heater to an arm, to which a jig supporting a wire as a body to be bonded is mounted, and heating the wire through the arm and the jig. CONSTITUTION:A wire 11 is penetrated through a capillary 6 through a clamper 14. A film heater 3 is conducted and a conductor 4 is heated, the nose of a first arm 2 is heated, and the wire 11 is heated through the capillary 6. The tip of the wire 11 is melted, and supported as heat transfer from the capillary 6 is left as it is kept. Since a lead frame as a bonding body is heated and a fixed temperature is kept, on the other hand, the dispersion of a contact bonding temperature is reduced when the wire is joined, and the wire can be joined at a desired contact bonding temperature, thus improving contact bonding properties, then preventing peeling after bonding and enhancing reliability. |
