发明名称 BONDING METHOD AND DEVICE
摘要 PURPOSE:To reduce the resonance of a lead frame, to improve the sliding efficiency of a wire on a joint surface and to prevent a mistake on joining by giving two kinds or more of vibrations to one of a body to be joined or another member. CONSTITUTION:When a bonding arm 1 is lowered and a wire projected from the tip of a capillary 8 is brought into contact with a body to be joined, a power supply 9 drives a piezoelectric element 2, a power supply 11 controls a piezoelectric element 3, the length and volume of the arm 1 are adjusted, vibrations of 40kHz are transmitted over the wire 13 through the capillary 8 efficiently, and the wire 13 is slid at 40kHz on the body to be joined. Likewise, vibrations of 40, 50 and 60kHz are applied at one interface. A bonding body is not resonated and the wire is joined in vibrations of 40 or 50kHz when the natural frequency of the bonding body is 60kHz, and no wire is peeled because the bonding body and the wire are resonated even when 60kHz is applied subsequently. According to the constitution, the bonding body and a body to be bonded can be joined when other frequency is applied even when the bonding body and the body to be bonded have resonance points, thus joining both bodies more positively than only the case of one kind of vibrations.
申请公布号 JPS6454741(A) 申请公布日期 1989.03.02
申请号 JP19870210122 申请日期 1987.08.26
申请人 HITACHI LTD;HITACHI YONEZAWA ELECTRON CO LTD 发明人 YAMAGUCHI YOSHIHIKO;HASEGAWA TAKESHI
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
代理机构 代理人
主权项
地址