| 摘要 |
PURPOSE:To sinter a substrate, after it is treated, and to improve the tensile strength of a bonded part by filling active metal-added silver brazing material in the through hole of the sintered substrate formed of aluminum nitride, and bonding lead pins through the silver brazing material to the body of the substrate. CONSTITUTION:An integrated circuit element 11 is placed through thin film multilayer interconnections 13 and a solder ball 12 on an AlN substrate 1 with through holes. Active metaladded silver brazing material 2 is filled in the through hole formed of aluminum nitride of the substrate 1. A plurality of lead pins 3 matched to the through holes are bonded through the brazing material 2 by the interconnections 13 or a predetermined jig simultaneously upon filling. The substrate 1 employs a high thermal conductivity AlN sintered plate to reduce a conductive resistance, thereby strengthening the tensile strength of the pin 3 to the substrate 1. |
