| 摘要 |
<p>PURPOSE:To improve heat dissipation characteristics as well as to prevent the generation of a crack in a package for resin-sealing a semiconductor element fixed on the surface of an island by a method wherein an opening to come into contact to the rear end parts of the island are provided on the rear of the package. CONSTITUTION:Apertures 17 are each formed at two places on the side of the rear of a package 16. The open inner end surfaces 18 are respectively formed into a surface inclined at 45 deg. to an island 11 and are set up in such a way that their central parts respectively come into contact to rear end parts 11-1 of the island 11. The parts 11-1 of the island 11 in immediately after a resin sealing are covered with a thin resin film and are not exposed in the apertures 17. However, the sealing resin is shrinked as the package 16 is cooled after the resin sealing, the thin resin film is broken and broken holes 22 are generated. The parts 11-1 of the island 11 are exposed in the openings 17 through these broken holes 22 and come into contact directly to the outside to obtain the effect of heat dissipation. Moreover, even though a semiconductor device is heated, vaporized water content is led out to the outside via the broken holes 22 and there is no possibility that a crack is generated in the package 16.</p> |
