| 摘要 |
<p>The disclosed means for coupling an optical fiber (52) and an opto-electronic device (e.g., LED, laser, or photodetector) (40) comprises a first body (10) having two substantially parallel major surfaces, with a recessed portion (a "well") (11) formed in one surface, and a through-aperture extending from the other surface to the well. Conductive means (21, 24) extend from the former surface onto the bottom of the well, and the opto-electronic device typically is mounted in the well such that the device does not protrude above the plane of the associated surface, such that the electrical contact is established between the device and the conductive means, and such that the active region of the device is centered upon the through-aperture. The first body is advantageously produced from a (100) Si wafer by means of standard Si processing techniques, including selective etching. The assembly can be mounted on a substrate, e.g., a Si wafer with appropriate metallization thereon, and the end of an optical fiber inserted into the through-aperture and secured to the first body. The assembly can be operated at relatively high speed, due to its relatively low parasitic capacitance and inductance, and can be mounted on the substrate in substantially the same was as IC chips are mounted, in close proximity to associated electrical components.</p> |
