| 摘要 |
PURPOSE:To obtain a printed wiring board with a high yield by a method wherein a conductor circuit pattern is formed on a conductive substrate and transferred onto the other substrate and the conductive substrate has a surface of molybdenum metal or molybdenum alloy. CONSTITUTION:The surface of a conductive substrate except a circuit pattern part is masked with a resist film and electroplating is applied to the circuit pattern part only to form a conductor circuit pattern. The circuit conductor formed on molybdenum metal is applied to the surface of the other substrate by thermocompression bonding. Then the molybdenum metal is peeled off to transfer the circuit conductor onto the insulating substrate and a printed wiring board is obtained. The surface roughness of the conductive substrate is preferably from Ra=0.001 to Ra=0.90mum. For instance, a plating-resistant photoresist film 2 is applied to a molybdenum metal plate 1 and, after degreasing, washing, acid treatment and washing, a copper plating layer 3 is formed on the circuit part of the surface of the molybdenum metal plate with copper sulfate plating solution. Then, after washing, the resist film 2 is removed and the copper plating layer 3 is applied to a glass-epoxy substrate by thermocompression bonding and the molybdenum metal plate is peeled off. |
