| 摘要 |
PURPOSE:To prevent generation of sag, etc., of resin at the corner for through holes and to enable formation of an accurate hole by radiation of ultraviolet rays before performing thermal setting of thermo setting resin coated on a metal substrate by a curing process. CONSTITUTION:A hole 4 is drilled on a metal substrate 1. Then, a thermosetting resin 13 is applied to an entire surface 2 of metal substrate 1 including an inner surface 5 within a hole 4 by the so-called anode process. A material with light curing characteristics is mixed with the thermosetting resin 13. Then, ultraviolet rays are radiated to enable semicuring so that the thick film may not sag due to its flow. Thus, in the end, it is prevented that a corner 32 of the hole 4 which becomes a through hole 31 becomes thin or the resin within a hole 4 becomes thick by sag. |
