| 发明名称 |
MOLD-RELEASING SHEET AND METHOD FOR APPLYING MOLD-RELEASING AGENT ONTO MOLD SURFACE USING SAID SHEET |
| 摘要 |
A mold-releasing sheet comprising a composition containing an uncured rubber, a curing agent and a mold-releasing agent, and a method for applying a mold-releasing agent onto a mold using the sheet. The sheet is used to efficiently apply a mold-releasing agent onto a surface of a mold by cleaning after a molding step in a process for continuously producing semiconductor devices by continuously encapsulating semiconductor elements with an epoxy resin composition, etc., by a transfer molding. |
| 申请公布号 |
EP0272685(A3) |
申请公布日期 |
1989.03.01 |
| 申请号 |
EP19870119049 |
申请日期 |
1987.12.22 |
| 申请人 |
NITTO DENKO CORPORATION |
发明人 |
KITAURA, TOSHIHIKO C/O KYUSHU NITTO DENKO;NAKAMURA, AKIO C/O KYUSHU NITTO DENKO;SAKAMOTO, MASAYUKI C/O KYUSHU NITTO DENKO;TAKASHIMA, KOUICHI C/O KYUSHU NITTO DENKO;HIRAKAWA, KIYOTAKA C/O KYUSHU NITTO DENKO;MIZOTA, MATAO C/O KYUSHU NITTO DENKO |
| 分类号 |
B29C33/58;B29C33/68;B29C33/72;C08K5/14;C08K5/3445;H01L21/56;(IPC1-7):B29C33/00 |
主分类号 |
B29C33/58 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
