发明名称 THREE-DIMENSIONAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 PURPOSE:To reduce time for inserting and pulling-out a chip at the time of maintenance and exchange accompanying an increase in the number of sheets of longitudinally stacked chips by a method wherein connection chips provided with a connector, which is easily detachable and is electrically connected, are provided. CONSTITUTION:A plurality of sheets of chips or wafers 1 are stacked longitudinally to each other, are connected electrically to each other at surfaces A and moreover, are fixed mechanically to each other. Chip groups 3, each consisting of a plurality of sheets of the chips, are connected to each other at surfaces B through con nection chips 2 having a connector, which is an easily detachable electrical connecting means. For example, in the case where 100 sheets of the chips 1 are stacked longitudinally, if 20 sheets of the chips 1 are collected into one chip group 3, the total is constituted of 5 maintenance and exchange units and the time needed for maintenance and exchange can be reduced. The connector structures appear only at 4 places among 100 sheets if the chips 1 and the effect to inflict on the high-speed operating efficiency of a whole device is little.
申请公布号 JPS6453440(A) 申请公布日期 1989.03.01
申请号 JP19870209317 申请日期 1987.08.25
申请人 HITACHI LTD 发明人 YASUNAGA MORITOSHI;YAMADA MINORU;MIZUISHI KENICHI
分类号 H01L27/00;H01L23/52;H01L23/538;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L27/00
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