发明名称 ELECTROLESS GOLD PLATING SOLUTION
摘要 PURPOSE:To obtain the title stable electroless gold plating soln. having low toxicity and capable of carrying out thick plating for a long time by incorporating the chloride or sulfide of lead as a stabilizer into the plating soln. contg. a gold (I) thiosulfate complex as a gold source. CONSTITUTION:The chloride or sulfide of lead and the stabilizer for inhibiting the autolysis of the plating soln. are incorporated into the plating soln. contg. a gold (I) thiosulfate complex as a gold source and contg. a reducing agent, a complexing agent, an antioxidant for the complex agent, a pH regulator, etc. Since the obtained electroless gold plating soln. does not contain a toxic cyanide ion, safety of the plating operation and simplification of the waste liq. treatment can be obtained. In addition, the soln. can be used for a long time due to the stabilizer.
申请公布号 JPS6452083(A) 申请公布日期 1989.02.28
申请号 JP19870208103 申请日期 1987.08.24
申请人 HITACHI LTD 发明人 TOMIZAWA AKIRA;USHIO JIRO;MIYAZAWA OSAMU;MATSUURA NAOKO;YOKONO ATARU
分类号 C23C18/44 主分类号 C23C18/44
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