| 摘要 |
PURPOSE:To obtain a laminated sheet for a multi-layer printed wiring board wherein dielectric constant is low, high-frequency characteristics are favorable, a high-frequency operational circuit and communication apparatus circuit can be prepared at high density, dimensional stability and electric insulation properties are excellent, by arranging in the laminated sheet a fluorine resin layer comprised of only PTFE resin and a base material into which fluorine resin mainly comprised of the PTFE resin has been infiltrated. CONSTITUTION:PTFE resin-impregnated base materials 2 are laminated by interposing PTFE resin 1 as a continuous fluorine resin layer, in a laminated sheet. Then the PTFE resin 1 is arranged also on the outsides of the PTFE resin-impregnated base materials 2a, 2b of both the outsides as the fluorine resin layer, and a metallic foil 3 is arranged on the PTFE resin 1 layer for monolithic molding. In this instance, about 100% of composition of the PTFE resin 1 is comprised of PTFE. Glass cloth is used for a base material 2 into which fluorine resin mainly comprised of the PTFE resin is infiltrated. Then emulsion of the fluorine resin such as the PTFE and the other PFA and FEP are infiltrated into the base material 2, the PTFE is melted by heating and integrated with the base material. In this instance, pressure molding of the same is performed at a temperature of the melting point or higher of the PTFE resin. With this construction, the same adheres close to the base material without influence on a dimensional change at the time of molding, and electrical insulation properties can be improved. |
